About

We’re building a next-gen smart access control device using a Toradex Verdin i.MX8M Mini SoM with a 10.1” LCD, camera, RFID/NFC, secure element, audio, PoE, and sensors. We need help creating a custom carrier board and a 3D-printed enclosure to take this to a go-to-market prototype. Scope: Carrier Board: Design compact PCB for Verdin SoM integrating MIPI-DSI/CSI, PoE RJ45, RFID/NFC, ATECC608A, PIR/ToF/light sensors, audio (I²S + Class-D amp), RGB LED strip, relay output, USB 2.0/3.0, GPIO headers, and microSD. Deliverables: schematics, layout, BOM, Gerbers, STEP model. Bonus: bring-up/device tree support. Enclosure: Design sleek, wall-mount housing for LCD, camera, RFID, and sensors. Must support 3D print prototype and injection mold later. Deliverables: CAD (STEP/STL), renders, print-ready files. Looking for: One engineer who can cover both, or two specialists (hardware + industrial design). Skills: Toradex/NXP SoM carrier boards, high-speed layout (MIPI/USB), PoE PD, IoT/sensor integration, CAD (Fusion/SolidWorks), 3D printing. Can include BOM. Please share relevant work and whether you cover PCB, enclosure, or both. We’re developing a next-generation smart access control device (physical + cyber security). The product will use a Toradex Verdin i.MX8M Mini SoM with a 10.1” LCD, camera, RFID/NFC reader, secure element, audio, PoE, and multiple sensors. We need help designing both the carrier board and the product enclosure to bring this to a go-to-market prototype. What We’re Looking For We’re open to hiring one full-service engineer who can cover both electronics + enclosure design, or separate specialists (one hardware engineer, one industrial designer).